CIRCUIT WORLD SCIE

中文简介

电路世界为电子电路、元件、组装和产品设计、制造、测试和使用等领域的最新技术、技术论文和社论提供了一个论坛，包括质量、可靠性和安全性。该杂志包括对当今和未来电子技术的各种理论、方法、技术、工艺和应用的多学科研究。该期刊在科学引文索引扩展SCIE（Clarivate Analytics）和Scopus中都排名。电路世界为研究、应用和当前意识提供了全面、权威的信息源。它与研究人员、高级技术人员、供应链管理、风险评估和执业工程师有关。电路世界涵盖了广泛的主题，包括：电路理论、设计方法、分析与仿真数字、模拟、微波和光电集成电路半导体、无源、连接器和传感器零部件、组件和产品的电子包装印刷电路板设计技术和工艺（控制阻抗、高速印刷电路板、层压板和层压、激光加工和钻孔、成型互连设备、多层板、光学印刷电路板、单面和双面板、焊接和可焊饰面）X的设计（包括可制造性、质量、可靠性、可维护性、持续性、安全性、再利用、处置）物联网

投稿网址：http://mc.manuscriptcentral.com/cw

英文简介

Circuit World provides a forum for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. The journal is ranked in both Science Citation Index Expanded SCIE (Clarivate Analytics) and Scopus. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. It is relevant to researchers, senior technical staff, supply chain management, risk assessment and practising engineers. Circuit World covers a broad range of topics, including:Circuit theory, design methodology, analysis and simulationDigital, analog, microwave and optoelectronic integrated circuitsSemiconductors, passives, connectors and sensorsElectronic packaging of components, assemblies and productsPCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)Internet of Things (IoT)