CMC-Computers Materials & Continua SCIE

中文简介

cmc的目的是吸引美国、欧洲、亚洲和世界上所有其他国家的精英研究机构做出最好的科学贡献。任命了四位杰出的主编。cmc是《cmes：工程与科学中的计算机建模》的配套期刊。当cmes发表对更广泛的读者具有根本意义的原始学术文章时，cmc则在新兴工程和科学研究学科的选定主题领域发表较短的原始兴趣文章。该期刊的范围包括以下主题：计算机建模和模拟；工程结构和功能材料的分析和合成；生物材料；智能材料和结构；固体和流体力学；微型机电系统；纳米机电系统；纳米微宏观级耦合建模；纳米结构复合材料；生物系统的化学力学工程；以及这些科学和技术在经济增长过程和产品开发中的应用等。

投稿网址：http://submission.techscience.com/cmc/login.asp

英文简介

The aim of CMC is to attract the best scientific contributions from the elite research institutions in the USA, Europe, Asia, and all other countries of the world. Four extraordinarily distinguished Editors-in-Chief have been appointed. CMC is a companion journal to "CMES: Computer Modeling in Engineering & Sciences". While CMES publishes original scholarly articles of fundamental interest to a much broader audience, CMC publishes shorter original articles of interest in selected topical areas in emerging engineering & science research disciplines. The scope of the journal is covered by the topics: computer modeling & simulation; analysis and synthesis of engineered structural and functional materials; biomaterials; smart materials and structures; solid and fluid mechanics; micro-electromechanical systems; nano-electromechanical systems; nano-micro-macro-level coupled modeling; nano-structured composites; chemomechanical engineering in biosystems; and application of these sciences and technologies in process-and-product development for economic growth, etc.