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JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING

JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING SCIE

1530-9827

工程技术

Quarterly

No

J COMPUT INF SCI ENG

55

UNITED STATES

http://computingengineering.asmedigitalcollection.asme.org/issues.aspx

>12周,或约稿审稿时间

容易平均录用比例

1.717影响因子

计算机:跨学科应用小学科

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中文简介

《美国机械工程师协会工程计算与信息科学杂志》(JCISE)发表了有关算法、计算方法、计算基础设施、计算机可解释表示、人机界面、信息科学和/或系统架构的文章,旨在改善产品和系统生命周期的某些方面。(例如,设计、制造、操作、维护、处理、回收等)。JCISE手稿中考虑的应用应与机械工程专业相关。论文可以集中在导致新方法的基础研究上,或者将现有方法改编为新的应用。JCISE涵盖的主题领域包括:先进的计算基础设施;人工智能;大数据和分析;协作设计;计算机辅助设计;计算机辅助工程;计算机辅助制造;加性制造的计算基础;工程优化的计算基础;计算几何;计算计量;计算综合;概念设计;网络制造;工厂的网络物理安全;网络物理系统设计和操作;数据驱动工程应用;工程信息学;几何推理;用于设计和制造的gpu计算;人类计算机接口/交互;物联网;知识工程;信息管理;工程应用的逆法;工程应用的机器学习;制造规划;制造自动化;基于模型的系统工程;多物理建模和模拟;多尺度建模和模拟;多学科优化;基于物理的模拟;工程应用的流程建模;资格认证;计算模型的验证和验证;工程应用的符号计算;公差建模;拓扑和形状优化;虚拟和增强现实环境;虚拟原型。

https://journaltool.asme.org/home/index.cfm

英文简介

The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications.Topic areas covered by JCISE include:Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping.

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JOURNAL OF INVESTIGATIVE DERMATOLOGY是SCI2区期刊。 JOURNAL OF INVESTIGATIVE DERMATOLOGY期刊涉及的研究方向为医学领域。 关于《JOURNAL OF IN
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其实对于中药领域的期刊在选择上并不必过于拘泥,尤其是在主题范围上要多广泛的延伸选择。所以这里整理了一些 药学
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