MECHANICS OF MATERIALS SCISCIE

中文简介

《材料力学》是固体力学和材料领域的一本杂志，其目的是在工程和自然材料领域广泛传播质量研究工作。它报告了原始研究，对从纳米到宏观尺度的子结构进行了机械定向描述，包括随时间变化和时间无关的行为、材料不稳定性、损伤和断裂机制，以及力学和电、化学和光学之间的相互作用。重点是检查应变率、时空尺度、微观结构特征的开始及其演变，以及力学和传输现象之间的耦合。该杂志还关注金属、聚合物、软材料、生物材料、天然材料、陶瓷、金属玻璃、颗粒材料、复合材料、形状记忆合金、纳米结构材料等的热-机械本构响应。基于力学的新兴领域研究，如3D打印、添加剂制造，鼓励使用生物启发材料、二维材料，例如石墨烯和薄膜。在上述领域中描述综合实验/计算/分析方法的文章也很有趣。为了引起研究者对新力学概念或新材料机制的兴趣，促进他们的讨论，我们征集了经过快速回顾的短篇文章，以便快速传播。欢迎客座编辑就专题研究领域发表专题文章，并欢迎新兴研究领域的专家发表评论和调查，但须经编委会批准。

投稿网址：http://ees.elsevier.com/mecmat/

英文简介

Mechanics of Materials, a journal in the field of solid mechanics and materials, aims to disseminate quality research work in the broad spectrum of engineering and natural materials. It reports original research with a mechanically oriented description of substructures from nano- to macro-scales encompassing time-dependent and time-independent behaviors, material instabilities, damage and fracture mechanisms, and interactions between mechanics and electricity, chemistry and optics. Particular emphasis is placed on the inspection of strain rates, spatio-temporal scales, inception of microstructural features and their evolution, and couplings between mechanics and transport phenomena.The journal also focusses on the thermo-mechanical constitutive response of metals, polymers, soft materials, bio-materials, natural materials, ceramics, metallic glasses, granular materials, composites, shape-memory alloys, nanostructured materials, etc. Mechanics-based investigations on emerging areas such as 3D printing, additive manufacturing, bio-inspired materials, 2D materials, e.g., graphene and thin films, are encouraged. Articles that describe combined experimental/computational/analytical approaches in the above fields are also of interest.To foster interest and promote discussion among researchers on new mechanics concepts or new material mechanisms, short articles which will undergo fast-track review for rapid dissemination are solicited. Special issues on topical research areas by guest editors, review articles and surveys by experts in emerging research fields are also welcome upon approval by the editorial board.