电子包装杂志发表论文，使用实验和理论(分析和计算机辅助)的方法、方法和技术来解决和解决在电子和光子学组件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。
https://journaltool.asme.org/home/JournalDescriptions.cfm?JournalID=5&Journal=EP
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
| 大类学科 | 分区 | 小类学科 | 分区 | Top期刊 | 综述期刊 |
| 工程技术 | 4区 | ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气 ENGINEERING, MECHANICAL 工程：机械 | 4区 4区 | 否 | 否 |
| JCR分区等级 | JCR所属学科 | 分区 | 影响因子 |
| Q3 | ENGINEERING, ELECTRICAL & ELECTRONIC | Q3 | 1.931 |
| ENGINEERING, MECHANICAL | Q3 |
| CiteScore | SJR | SNIP | 学科类别 | 分区 | 排名 | 百分位 |
| 3.70 | 0.493 | 0.861 | 大类：Engineering 小类：Mechanics of Materials | Q2 | 145 / 384 |
62% |
| 大类：Engineering 小类：Electrical and Electronic Engineering | Q2 | 284 / 708 |
59% |
|||
| 大类：Engineering 小类：Computer Science Applications | Q2 | 307 / 747 |
58% |
|||
| 大类：Engineering 小类：Electronic, Optical and Magnetic Materials | Q2 | 122 / 259 |
53% |
| 影响因子 | h-index | Gold OA文章占比 | 研究类文章占比 | OA开放访问 | 平均审稿速度 |
| 1.931 | 46 | 1.18% | 90.57% | 未开放 | >12周，或约稿 |
