MICROELECTRONIC ENGINEERING SCISCIE

中文简介

《微电子工程》拥有开放获取的镜像期刊《微纳工程》，目标和范围相同，编辑团队、投稿系统和严格的同行评审。《微电子工程》是一本以电子、光子、生物电子、机电和流体设备及系统的制造为主要内容的纳米加工和纳米技术期刊。它还涵盖了“超过摩尔”和“超越摩尔”集成纳米电子/光子学和微/纳米/生物系统的不断扩展的跨学科领域。通过其独特的混合同行评审文章，评论，加速出版物，简短和技术说明，以及最新的研究新闻的关键发展，微电子工程提供了这一令人兴奋的，跨学科的和动态的学术界和工业界的研究人员的新领域的全面报道。该杂志涉及以下主题，并考虑的主要是实验工作，或理论/模拟工作直接联系和支持该领域的实验:微电子加工与材料(光刻、自组装、等离子体加工、金属化、3D集成、相关材料等)微/纳米工程/制造/技术/制造纳米电子和光子器件及其制备微系统、微器件(如传感器和纳米能源器件)及其制造微流体、生命科学设备/传感器，以及集成芯片实验室及其制造

投稿网址：http://ees.elsevier.com/mee/

英文简介

Microelectronic Engineering has an open access mirror journal Micro and Nano Engineering, sharing the same aims and scope, editorial team, submission system and rigorous peer review.Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)Micro-/Nano-engineering / fabrication / technology / manufacturingNanoelectronic and photonic devices and their fabricationMicrosystems, microdevices (e.g., sensors and nanoenergy devices) and their fabricationMicrofluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication